Vacuum Potting & Vacuum Encapsulation

Typically, electronic components are loaded into enclosures, placed into a vacuum chamber and evacuated below 10 mmHg.  De-gassed epoxy is then filled into the enclosures until a witness pipe indicates an overflow condition. 

​Dry air or nitrogen is added to establish a 50 to 90 psi condition.  Chamber pressure is returned to atmosphere and the potted enclosures are removed.  A control system automates the process by running repeatable recipes while recording pressure, temperature and process alerts.  Machine operators load the enclosures into the chamber, close the door, manually admit epoxy when the control system indicates to do so and remove the potted enclosures when the control system indicates the process is complete.

​A control system automates the process by running repeatable recipes while recording pressure, temperature and process alerts.   Machine operators load the coils into the chamber, close the lid, hit the start button and remove the coils when the control system indicates the process is complete.